Obtención de materiales metálicos de tamaño de grano ultrafino
Abstract
Con este trabajo se busca proporcionar una visión general de los procesos de Severa Deformación Plástica (SPD del acrónimo en inglés). Este proceso es considerado uno de los más importantes para obtener cantidades industriales de materiales metálicos con tamaño de grano inferior a 1 μm, al cual se le denomina grano ultrafino. En el texto se realiza una descripción de las más importantes técnicas pertenecientes a SPD; refiriéndose a los principios fundamentales, ventajas y limitaciones de cada una de ellas. Adicionalmente, se incluyen algunas de las aplicaciones potenciales que los materiales metálicos UFG (Ultra - Fine Grain) presentan gracias al significativo incremento de las propiedades mecánicas y físicas con respecto a los materiales metálicos convencionalDownloads
Downloads
-
Vistas(Views): 383
- PDF (Español (España)) Descargas(Downloads): 317
Published
How to Cite
Issue
Section
License
Copyright (c) 2017 Scientia et technica
This work is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International License.
Copyrights
The journal is free open access. The papers are published under the Creative Commons Attribution / Attribution-NonCommercial-NoDerivatives 4.0 International - CC BY-NC-ND 4.0 license. For this reason, the author or authors of a manuscript accepted for publication will yield all the economic rights to the Universidad Tecnológica of Pereira free of charge, taking into account the following:
In the event that the submitted manuscript is accepted for publication, the authors must grant permission to the journal, in unlimited time, to reproduce, to edit, distribute, exhibit and publish anywhere, either by means printed, electronic, databases, repositories, optical discs, Internet or any other required medium. In all cases, the journal preserves the obligation to respect, the moral rights of the authors, contained in article 30 of Law 23 of 1982 of the Government Colombian.
The transferors using ASSIGNMENT OF PATRIMONIAL RIGHTS letter declare that all the material that is part of the article is entirely free of copyright. Therefore, the authors are responsible for any litigation or related claim to intellectual property rights. They exonerate of all responsibility to the Universidad Tecnológica of Pereira (publishing entity) and the Scientia et Technica journal. Likewise, the authors accept that the work presented will be distributed in free open access, safeguarding copyright under the Creative Commons Attribution / Recognition-NonCommercial-NoDerivatives 4.0 International - https://creativecommons.org/licenses/by-nc-nd/4.0/deed.es license.