Proceso de soldadura por transferencia de metal en frio
DOI:
https://doi.org/10.22517/23447214.3789Abstract
El proceso de soldadura por transferencia de metal frio, es la evolución del proceso GMAW, pero incorpora una nueva técnica, para desprender las gotas de metal de aporte, logrando transferir el metal con una muy baja intensidad de calor. El resultado puede ser descrito como una alternada secuencia calor-fríocalor- frío que reduce en gran medida la presión del arco. La combinación de una reducción de aporte térmico y la ausencia de chisporroteo hacen posible el uso de soldadura para aplicaciones que no habría sido posible antes, además que entrega beneficios como una mayor productividad, menos rechazos y menos acabado soldaduraDownloads
Downloads
-
Vistas(Views): 1468
- PDF (Español (España)) Descargas(Downloads): 582
Published
How to Cite
Issue
Section
License
Copyrights
The journal is free open access. The papers are published under the Creative Commons Attribution / Attribution-NonCommercial-NoDerivatives 4.0 International - CC BY-NC-ND 4.0 license. For this reason, the author or authors of a manuscript accepted for publication will yield all the economic rights to the Universidad Tecnológica of Pereira free of charge, taking into account the following:
In the event that the submitted manuscript is accepted for publication, the authors must grant permission to the journal, in unlimited time, to reproduce, to edit, distribute, exhibit and publish anywhere, either by means printed, electronic, databases, repositories, optical discs, Internet or any other required medium. In all cases, the journal preserves the obligation to respect, the moral rights of the authors, contained in article 30 of Law 23 of 1982 of the Government Colombian.
The transferors using ASSIGNMENT OF PATRIMONIAL RIGHTS letter declare that all the material that is part of the article is entirely free of copyright. Therefore, the authors are responsible for any litigation or related claim to intellectual property rights. They exonerate of all responsibility to the Universidad Tecnológica of Pereira (publishing entity) and the Scientia et Technica journal. Likewise, the authors accept that the work presented will be distributed in free open access, safeguarding copyright under the Creative Commons Attribution / Recognition-NonCommercial-NoDerivatives 4.0 International - https://creativecommons.org/licenses/by-nc-nd/4.0/deed.es license.