Técnicas utilizadas para la medición de esfuerzos residuales en películas delgadas depositadas por pvd
Abstract
Los esfuerzos residuales afectan de manera directa propiedades mecánicas tan importantes en un recubrimiento como son la adhesión, la resistencia al desgaste, la resistencia a la fatiga, la dureza entre otras; esto se ve reflejado en una disminución del tiempo de vida útil del recubrimiento. Por tal motivo, el estudio de los esfuerzos residuales en recubrimientos cobra cada día mayor importancia, ya que ellos afectan su integridad y desempeño, haciéndose necesaria su medición y control. En este artículo se hace una revisión de los fundamentos de las técnicas más utilizadas para la medición de esfuerzos residuales en películas delgadas depositadas por PVD.Downloads
Downloads
-
Vistas(Views): 892
- PDF (Español (España)) Descargas(Downloads): 4954
Published
How to Cite
Issue
Section
License
Copyright (c) 2017 Scientia et technica
This work is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International License.
Copyrights
The journal is free open access. The papers are published under the Creative Commons Attribution / Attribution-NonCommercial-NoDerivatives 4.0 International - CC BY-NC-ND 4.0 license. For this reason, the author or authors of a manuscript accepted for publication will yield all the economic rights to the Universidad Tecnológica of Pereira free of charge, taking into account the following:
In the event that the submitted manuscript is accepted for publication, the authors must grant permission to the journal, in unlimited time, to reproduce, to edit, distribute, exhibit and publish anywhere, either by means printed, electronic, databases, repositories, optical discs, Internet or any other required medium. In all cases, the journal preserves the obligation to respect, the moral rights of the authors, contained in article 30 of Law 23 of 1982 of the Government Colombian.
The transferors using ASSIGNMENT OF PATRIMONIAL RIGHTS letter declare that all the material that is part of the article is entirely free of copyright. Therefore, the authors are responsible for any litigation or related claim to intellectual property rights. They exonerate of all responsibility to the Universidad Tecnológica of Pereira (publishing entity) and the Scientia et Technica journal. Likewise, the authors accept that the work presented will be distributed in free open access, safeguarding copyright under the Creative Commons Attribution / Recognition-NonCommercial-NoDerivatives 4.0 International - https://creativecommons.org/licenses/by-nc-nd/4.0/deed.es license.