Evaluación de materiales con aplicaciones electronicas, bajo ensayos acelerados de corrosión


Authors

  • Diana Marin
  • Maryory Gomez Botero
  • Felix Echeverría

Abstract

En este trabajo se evaluó el comportamiento frente a la corrosión de diferentes materiales utilizados en la industria electrónica. Se depositaron películas delgadas de Al, Cu, Ni y una bicapa Cu/Au sobre sustratos de mica mediante evaporación física en fase vapor. Circuitos simulados y probetas individuales, fueron expuestos a ensayos acelerados de corrosión en cámara climática, bajo una atmósfera mixta de NOx y SO2. Las muestras se caracterizaron mediante microscopía óptica, STM, AFM, XPS, SEM y EDS, y se determinó la rugosidad. El orden de desempeño de los depósitos fue como sigue bicapa Au/Cu > Ni > Al > Cu.

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Published

2007-07-30

How to Cite

Marin, D., Gomez Botero, M., & Echeverría, F. (2007). Evaluación de materiales con aplicaciones electronicas, bajo ensayos acelerados de corrosión. Scientia Et Technica, 1(36). Retrieved from https://ojs2.utp.edu.co/index.php/revistaciencia/article/view/5083

Issue

Vol. 1 No. 36 (2007)

Section

Mecánica

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