Modelo termodinámico para el control del enfriamiento en un proceso de formación de envases de vidrio
Abstract
Este trabajo plantea el modelamiento de un ventilador centrífugo empleado en el control del sistema de refrigeración de molduras, en una línea de fabricación de envases de vidrio, bajo condiciones ambientales variables. El modelo termodinámico empleado permitió identificar una correlación lineal entre la presión y la temperatura en la descarga, así como calcular numéricamente el valor de los parámetros de esta función. La recta de calibración obtenida (Tracking) fue implementada en la línea de producción permitiendo, con un pequeño ajuste de los parámetros, un control confiable del sistema de refrigeración de las molduras.Downloads
Downloads
-
Vistas(Views): 448
- PDF (Español (España)) Descargas(Downloads): 526
Published
How to Cite
Issue
Section
License
Copyright (c) 2017 Scientia et technica
This work is licensed under a Creative Commons Attribution-NonCommercial-ShareAlike 4.0 International License.
Copyrights
The journal is free open access. The papers are published under the Creative Commons Attribution / Attribution-NonCommercial-NoDerivatives 4.0 International - CC BY-NC-ND 4.0 license. For this reason, the author or authors of a manuscript accepted for publication will yield all the economic rights to the Universidad Tecnológica of Pereira free of charge, taking into account the following:
In the event that the submitted manuscript is accepted for publication, the authors must grant permission to the journal, in unlimited time, to reproduce, to edit, distribute, exhibit and publish anywhere, either by means printed, electronic, databases, repositories, optical discs, Internet or any other required medium. In all cases, the journal preserves the obligation to respect, the moral rights of the authors, contained in article 30 of Law 23 of 1982 of the Government Colombian.
The transferors using ASSIGNMENT OF PATRIMONIAL RIGHTS letter declare that all the material that is part of the article is entirely free of copyright. Therefore, the authors are responsible for any litigation or related claim to intellectual property rights. They exonerate of all responsibility to the Universidad Tecnológica of Pereira (publishing entity) and the Scientia et Technica journal. Likewise, the authors accept that the work presented will be distributed in free open access, safeguarding copyright under the Creative Commons Attribution / Recognition-NonCommercial-NoDerivatives 4.0 International - https://creativecommons.org/licenses/by-nc-nd/4.0/deed.es license.